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Modeling Solder Crack and the Relationship with Resin Delamination in a Power Leadframe Package
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)Publication Date: 2019-15-07
Authors : Jefferson S. Talledo;
Page : 475-475
Keywords : Power leadframe package; solder crack; resin crack; mechanical modeling; finite element model;
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Find it from : Google Scholar
Abstract
A leadframe package for power device applications usually needs excellent thermal performance. Recent trend is to use dual side cooling where an exposed copper clip acting as heat sink is attached to the die using solder material in addition to the leadframe as shown in Fig. 1.
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Last modified: 2020-06-13 16:22:10