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Critical Insights in the Effect of Tool Dimension to the Tilting Behavior of Silicon Die
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)Publication Date: 2019-15-07
Authors : Rennier S. Rodriguez;
Page : 487-487
Keywords : MEMS die; ASIC die: Tool Dimension; Correlation Study.;
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Abstract
MEMS or (Micro-Electromechanical System) Packaging is one of the technology under surface mount devices. Typically the architecture of a MEMS package is composed of 2 kinds of silicon die: (1) MEMS die which is fabricated with the microscopic moving parts and (2) the ASIC die that contains the functional circuit for the MEMS.
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Last modified: 2020-06-13 16:31:12