Probond Approach a Key to Minimizing the Effects of Bond Pad Anomaly

Wirebonding integrity is always a challenge in assembly manufacturing as sudden changes on wafer fabrication wherein no visual manifestation is detectable but results to a high rejection of non-stick on pad. Identifying the rootcause and communicating what needs to be corrected on the wafers requires a thorough analysis and validation. As it would take time to correct the problem, delivery of products must still be sustained and breakthrough solution to mitigate the effect of bond pad anomaly is essential. This technical paper went through a lot of extensive characterization to arrive at the rootcause of low palladium plating thickness of the bond pad through correlation. Collaboration with wafer fab was done to arrive at the optimum thickness that will yield good wirebond response. Probond feature of existing wirebond machine was utilized while wafer fab improvements is underway.