HVQFN Onemap Process Robustification through Mold Compound Size Optimization

In a bold effort to have major breakthrough in cost saving single map leadframe or onemap for HVQFN (Heat sink Very Thin Quad Flat No Leads) was conceptualize and was implemented using HVQFN40-01 as the pilot packages. This includes major change in the mold process both tooling and materials. Several learnings was realized at mold on issues such as incomplete fill/voids, crumpled leadframe and package crack as it was intermittently encountered specially during project fan-out on other packages. Key item considered is the response of the compound weight to different packages. This technical paper will be tackling all areas to consider in finalizing the desired mold compound weight for one map leadframe design based from mold compound supplier capability and the effects of silicon die sizes, leadframe design and mold tooling tolerances against the mold compound size or weight. By the end of this report we will be able to identify the required mold compound weight for one map leadframe across all HVQFN packages