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A Semiconductor IC Packaging Solution for Device Miniaturization
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)Publication Date: 2019-15-07
Authors : Frederick Ray I. Gomez Rennier S. Rodriguez;
Page : 559-560
Keywords : Silicon die; semiconductor; package design; miniaturization; densification.;
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Abstract
Miniaturization and densification is the current roadmap of all semiconductor devices. Downsizing or decreasing the size of a semiconductor integrated circuit (IC) as depicted in Fig. 1 while increasing the number of functional components is one example of miniaturization and densification.
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Last modified: 2020-06-13 16:54:34