Insights into the Thermal Management Performance of QFN Package with Embossed Die Pad

— Power devices in QFN platform requires efficient thermal management system. The use of conductive glue, sintered or semisintered adhesives, or solder materials ensure effective thermal dissipation. Herein, a new leadframe design where embossed patterns are introduced into the die pad is evaluated. Insights into the effect of the introduced design feature in terms of thermal dissipation are discussed. In brief, the embossed pattern results in minimal thermal gain of about 1 % using power glue, and about 3% using a 30 µm conductive die attach film (cDAF). Reducing the cDAF thickness is expected to further increase the thermal gain