Reduction of Tape Sticking Effect on Leadframe Platform for Thin Applications

Driven by the direction for smaller devices, the development of thinner version of leadframe become one of the key contributor for miniaturization. Leadframe semiconductor carrier or just leadframe shown in Fig. 1 is the metal structure inside semiconductor integrated circuit (IC) device which carry the signal from the silicon die to board level application. During IC assembly, the backside of the leadframe is attached to polyimide tape which supports the frame/carrier during front-of-line processes such as the die attach, wirebond process