Modeling Wire Bonding on Overhang Die to Ensure No Die Crack in Thin BGA Packages

In the design and development of a thin BGA (ball grid array) semiconductor package, the trend is to use thinner dies stacked one on top of another.  In addition to challenges with handling thinner dies, the design of the die bond pad layout and package size reduction require the use of overhang die configuration as shown in Fig. 1.  The wire bonding capillary applies force (30 gf) to the bond pad on the end of the overhang die (70 µm thickness) to bond the wire for electrical connection.