Reduction of Copper(II) Oxide on Bare Leadframe Through N2 Atmosphere Curing

One of the recognized candidate for the base material of leadframe is copper due to its abundance in resources and inexpensive cost as compared to other noble material such as silver and gold.  Leadframe is the direct material used for Quad Flat No-lead (QFN) and Quad Flat No-lead packages (QFP) assembly.  During manufacturing, the leadframe is used to carry the silicon die and wire until the unit is encapsulated.  Illustrated in Fig. 1 is the QFN Assembly process flow