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Modeling Study on Die Attach Glue Voids in Very Thin Smart Card Module
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 4)Publication Date: 2020-08-15
Authors : Jefferson S. Talledo;
Page : 6-8
Keywords : Die attach; glue voids; smart card module; die crack; molding; finite element modeling.;
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Abstract
A very thin smart card module considered in this study uses die attach glue to bond the thin silicon die to the leadframe die pad as shown in Fig. 1. The metal leadframe in a continuous reel format is so thin that it already becomes flexible. After die attach and wire bonding, the module is molded with epoxy molding compound or resin using a high pressure molding equipment.
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Last modified: 2020-06-14 20:27:40