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A Study on the Impact of Solder Voids on the Solder Joint Reliability of a QFN Package
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 4)Publication Date: 2020-08-15
Authors : Jefferson S. Talledo;
Page : 55-57
Keywords : — Solder voids; solder joint reliability; thermal cycling; finite element modeling;
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Abstract
A QFN (quad flat no lead) package is usually mounted to the PCB (printed circuit board) using solder material to establish electrical and mechanical connection as illustrated in Fig. 1. To ensure the reliability of solder joint, the board-mounted package is subjected to thermal cycling and the solder joint connection is monitored to determine the number of thermal cycles before failure (solde
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Last modified: 2020-06-14 20:41:56