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Maintaining Acceptable Level of MEMS Strip Warpage through Package Thickness Control
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 4)Publication Date: 2020-08-15
Authors : Jefferson S. Talledo;
Page : 58-59
Keywords : MEMS strip warpage; package thickness control; model validation; finite element modeling;
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Abstract
MEMS (micro-electro-mechanical system) semiconductor package is assembled in a single panel large substrate strip format as shown in Fig. 1. Package molding or encapsulation is done using compression molding process.
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Last modified: 2020-06-14 20:42:45