Process Improvement Through Modification of Overload Sensor in Singulation Station

 Singulation process in semiconductor assembly manufacturing is a process typically performed to separate integrated circuit packages such as IC chips from a substrate / leadframe in order to form the individual units.  Package crack is one of the top rejects at package singulation process and this trigger to have a big impact affecting process yield of the product lot.  Illustrated in Fig. 1 is the Assembly process flow of QFN (Quad Flat No leads) and as enclosed by a red dotted line is the process where rejects occur.