Die Attach Optimization for DAF Delamination

Semiconductor packages delamination mechanism defect refers to interface adhesion failures between either die to die attach material, die attach material to die paddle interface, or mold compound material to die paddle interface delamination, all of which are equally critical, in any packages as illustrated in Figure 1. Most of the devices with minor delamination are not easily detectable during device testing, but may potentially cause product reliability and functional failure in certain applications in the field, especially after external mechanical stresses have been applied. The Semiconductor manufacturer may suffer heavy cost impacts if the suspected defective units have to be recalled as customer return. Thus, the semiconductor