Share Your Research, Maximize Your Social Impacts
IC Package Design and Process Improvement for Topside Crack of Plastic Encapsulant
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)Publication Date: 2019-15-07
Authors : Rennier S. Rodriguez Maiden Grace R. Maming Frederick Ray I. Gomez;
Page : 150-150
Keywords : Chip-out; package crack; sidewall; semiconductor package; mechanical blade.;
Source : Download
Find it from : Google Scholar
Abstract
Package singulation is the process of separating molded or encapsulated integrated circuit (IC) device into individual units through mechanical dicing blade
Other Latest Articles
- Development of Website Based Modules on Basic Networks and Computer Subjects at SMK Negeri 5 Padang
- The Implementation of Project-Based Learning Mastercam Module Development in Vocational High School
- Evaluation of the Use Flour Kenikir (Cosmos caudatus Kunth) as an Organic Feed Additive on External Eggs Quality of Laying Hens
- Industrial Land Use Interaction Model - Road Network to Know the Effect of Goods Vehicles on Road Performance
- The Role of Emotional Regulation on SelfAcceptance of the Inmates
Last modified: 2020-06-11 19:11:51