Share Your Research, Maximize Your Social Impacts
Redefining Substrate Pre-Bake Method for Strip Warpage Improvement
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)Publication Date: 2019-15-07
Authors : Michael D. Capili Frederick Ray I. Gomez;
Page : 155-157
Keywords : Substrate; die attach flow; pre-bake; warpage; process improvement.;
Source : Download
Find it from : Google Scholar
Abstract
Substrate material or the substrate strip in Fig. 1 played a very important role in packaging industry, not only because it represents a great portion of the cost but also has a great influence on package performanc
Other Latest Articles
- Mechanical and Chemical Treatment for Copper Burr Elimination in Wettable Flank QFN
- ESD Diode on Die of Semiconductor QFN Device
- IC Package Design and Process Improvement for Topside Crack of Plastic Encapsulant
- Development of Website Based Modules on Basic Networks and Computer Subjects at SMK Negeri 5 Padang
- The Implementation of Project-Based Learning Mastercam Module Development in Vocational High School
Last modified: 2020-06-11 19:15:09