Mold Culls for Die Attach Adhesive Filler

Cost initiatives were required in the semiconductor field in order to be cost effective. Reprocessing of different by-products across the manufacturing process have gained opportunity to become cost effective. The paper discusses the introduction of fillers present on the mold culls from the molding process to salvage for die attach adhesive filler. The innovative process solution involves crushing of the culls, sieving the fillers and prepare it to mix with epoxy adhesive material; then will be filled into the syringe. The process will also reinforced the epoxy adhesive to increase mechanical strength of the package.