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Solder Land Pad Augmentation for Screen Printing Process Improvement

Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)

Publication Date:

Authors : ;

Page : 160-160

Keywords : Solder; land pad; solder bump; screen print; semiconductor; substrate; leadframe.;

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Abstract

Emerging technology on semiconductor packaging offers leadframe packages with one connection layer comparable to a substrate, as shown in Fig.1 with a onepanel or one-map strip design

Last modified: 2020-06-11 19:17:40