Solder Land Pad Augmentation for Screen Printing Process Improvement

Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)

Publication Date: 2019-15-07

Authors : Bryan Christian S. Bacquian Frederick Ray I. Gomez;

Page : 160-160

Keywords : Solder; land pad; solder bump; screen print; semiconductor; substrate; leadframe.;

Source : Download Find it from : Google Scholar

Abstract

Emerging technology on semiconductor packaging offers leadframe packages with one connection layer comparable to a substrate, as shown in Fig.1 with a onepanel or one-map strip design

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Solder Land Pad Augmentation for Screen Printing Process Improvement

Abstract

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