A Collaborative Approach in Understanding the Die Crack Occurrence during Die Attach Assembly

Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)

Publication Date: 2019-15-07

Authors : Rennier S. Rodriguez Frederick Ray I. Gomez;

Page : 161-161

Keywords : Die bond; die attach; semiconductor; die crack; pick and place; DOE; process improvement.;

Source : Download Find it from : Google Scholar

Die bonding process or die attach process refers to the “pick and bonding” process of silicon die from wafer tapes to a carrier, as shown in Fig. 1