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Warpage Improvement at Wirebond Assembly Process of Semiconductor QFN Device
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)Publication Date: 2019-15-07
Authors : Jonathan C. Pulido Frederick Ray I. Gomez;
Page : 332-333
Keywords : Leadframe; process improvement; wirebond process; warpage; WCTP; semiconductor;
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Find it from : Google Scholar
Abstract
One of the critical issues during assembly manufacturing process of semiconductor quad flat no-leads (QFN) leadframe
package or device is the warpage illustrated in Fig. 1
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Last modified: 2020-06-12 20:20:55