Innovative Approach Controlling the Epoxy Fillet Height for Thinner Die

There is a clear trend in the semiconductor packaging industry towards the use of thinner die, and reduced size packages, driven mainly by higher functionality of hand-held and portable devices. This trend causes some challenges to the use of traditional die attach paste adhesives, as the paste spreads to form a fillet, and also risks the adhesive flowing into the top of the die. At the same time, demands for electrical and thermal performance together with reliability are increasing. What's more, manufacturing yield continues to be crucial to control costs. Also semiconductor packaging apparatus for preventing cracking and delamination in a packaged semiconductor chip by controlling the die attach fillet height. Controlling the epoxy fillet height was not easy in Die Attach process specially for the thinner die thickness. This paper summarizes most recent learning's pertaining to the thin die bonding process, on how to achieve and control the fillet height during Die Attach as showed in figure 1.