Package Voids Elimination in Fragile Flip Chip System in Package Device

The thin package outline and sensitivity to pressure due to its pillar structure, requires a well developed process in transfer mold packaging that will minimize package voids while ensuring device performance. This technical paper outlines the Define, Measure, Analyze, Implement, Control (DMAIC) method utilized in the development of the process. The methodology covers both detection and failure identification as per process mapping. With a very keen understanding of the package construction, actions were carefully validated to known rootcause for voids resulting to improved voids performance and reliable product quality.