Characterization of Mold Surface Morphology to Achieve Optimum Scan Yield in a Complex Mark Format

Laser technology is the widely used technology in marking semiconductor devices. However, the demand for more data content on marking like 2D code impose a big challenge in marking quality. On top of this some mold compound types are also aggravating the legibility of the marking as pigments of laser are not so legible. While conventional way of improving legibility of marking is via optimization of laser or mark scan parameters, this technical paper however will focus on the study on the correlation effects of mold surface morphology by identifying what surface roughness range that will yield optimum marking quality on an automatic scan environment. In this paper we will also discuss how surface roughness on different molding technology like compression and transfer mold can be controlled.