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Reducing the See-saw Effect of Un-balanced Die-Pad Architecture for COSL Device
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 4)Publication Date: 2020-08-15
Authors : Rennier S. Rodriguez;
Page : 9-9
Keywords : Silicon die; Semiconductor Die; COSL; See-saw effect; Non-conductive Film.;
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Abstract
COSL or Chip-on-single-lead is a kind of architecture from QFN (Quad Flat No-lead) devices wherein the silicon die is attached to a single lead instead of leadframe pads. Often COSL design is recommended for small package dimension (< 1mm) wherein there is minimal number of I/O count
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Last modified: 2020-06-14 20:28:30