Improvement in Stencil Printing for Solder Paste Process of Semiconductor Device

Surface mount technology (SMT) includes a solder paste printing process wherein the solder paste material is applied below the semiconductor device using stencil printing  Development of this type of technology applied in a semiconductor leadframe package offers great challenges, especially as the stencil printing is used for the solder ball creation  A specialized semiconductor leadframe package shown in Fig. 1 with high-density input-output (I/O) connectivity requires the said stencil printing for solder paste process