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Critical Insights in the Design and Application of Die Attach Tooling per Carrier Construction
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)Publication Date: 2019-15-07
Authors : Edwin M. Graycochea Jr. Frederick Ray I. Gomez Rennier S. Rodriguez;
Page : 336-337
Keywords : Process plate; vacuum design; anvil block; die attach process; diebonding; leadframe; semiconductor carrier;
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Abstract
Die attach process or diebonding is the process of “picking and attaching” of silicon die to a carrier either by die attach film (DAF) or glue adhesives A process plate or anvil block is used to hold the semiconductor carrier wherein it is supplied with dedicated vacuum underneath the carrier
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Last modified: 2020-06-12 20:24:04