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Understanding the Impact of Underfill Fillet: A Key to Die Crack Elimination in FCBGA Packages
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)Publication Date: 2019-15-07
Authors : Jefferson S. Talledo;
Page : 338-338
Keywords : Die crack; underfill; stress analysis; finite element analysis; thermal cycling; flip-chip BGA packag;
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Abstract
Flip chip ball grid array (FCBGA) package is a laminate substrate-based semiconductor package with silicon die having solder bump for providing electrical connection between the active die side to the substrate as shown in Fig. 1. This eliminates the use of wire bonding to connect the die bond pad to the substrate pad.
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Last modified: 2020-06-12 20:25:41